Search Menu
Photonics Media Photonics Buyers' Guide Photonics EDU Photonics Spectra BioPhotonics EuroPhotonics Industrial Photonics Photonics Showcase Photonics ProdSpec Photonics Handbook
More News
Email Facebook Twitter Google+ LinkedIn Comments

TSV Development Partnership

Photonics Spectra
Dec 2010
CEA-Leti and SPP Process Technology Systems of Grenoble, France, and Tokyo, respectively, have announced their partnership to develop 300-mm through-silicon via (TSV) 3-D integrated circuit processes at CEA-Leti’s company’s facilities in France. The partners will research alternative hardware and processes to address the need for new, cost-effective methods for via fill. In addition, the agreement defines their collaboration on a range of 3-D TSV processes that optimize the etch and deposition technologies used to create high-aspect-ratio TSVs.

3-D integrated circuit3-D TSVBusinessCEA-Letidepositionetchfiber opticsFrancehardwarehigh-aspect ratiolight speedopticsSPP Process Technology Systemsthrough-silicon visTokyoTSV

Terms & Conditions Privacy Policy About Us Contact Us
back to top
Facebook Twitter Instagram LinkedIn YouTube RSS
©2018 Photonics Media, 100 West St., Pittsfield, MA, 01201 USA,

Photonics Media, Laurin Publishing
x Subscribe to Photonics Spectra magazine - FREE!
We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.