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Bodkin Design Issued Hyperspectral Imaging Patents
Jul 2013
NEWTON, Mass., July 1, 2013 — Bodkin Design & Engineering (BD&E) LLC has received two US patents for enhancements to its nonscanning hyperspectral imaging product line.

US Patent Nos. 8,174,694 and 8,233,148 support technology implemented for high-speed collection of 3-D hyperspectral images (two spatial dimensions plus spectral information), and provide flexibility over a trade between spectral and spatial resolution.

The VNIR-20B, a 20-color hyperspectral imager. Courtesy of BD&E.

The systems use patented HyperPixel Array technology to release the full information potential of any scene, providing an enhanced data stream, eliminating motion artifacts and maximizing signal-to-noise response. Operating in wavelengths ranging from the visible through the long-wave IR, the systems can interface with any fore optics, from telescope to microscope, the company said.

For more information, visit:

hyperspectral imaging
Methods for identifying and mapping materials through spectroscopic remote sensing. Also called imaging spectroscopy; ultraspectral imaging.
spatial resolution
In a vision system, the linear dimensions (X and Y) of the field of view, as measured in the image plane, divided by the number of pixels in the X and Y dimensions of the system's imaging array or image digitizer, expressed in mils or inches per pixel.
AmericasBD&EBodkin Design & EngineeringBusinessdata streamfore opticsHyperPixel Array technologyhyperspectral imagingimaginglong-wave infraredLWIRMassachusettsMicroscopyspatial resolutionspectral resolutionUS patents

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