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NIR Imaging Detects Cracks in Silicon Wafers

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Austin Richards, Flir Systems, Indigo Operations
Jon Lesniak, Stress Photonics
Gavin Horn, University of Illinois

Silicon wafers are the fundamental building blocks of the microelectronics industry. The size of those used in fabricating integrated circuits has steadily increased because larger wafers yield more parts per processing step. As wafers grow to 300 mm in diameter and beyond, they become increasingly fragile and prone to stress buildup during manufacture. Residual stress accumulates during the growth, sawing, lapping/grinding, etching and polishing operations before the wafer has even begun the processing stages necessary for integrated circuit manufacture. Cracks may be generated...Read full article

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    Published: August 2004
    Accent on ApplicationsApplicationscamera-based imaging systemindustrialnear-IR transmissionPolarized near-IR stress analysisSensors & Detectorssilicon wafers

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