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Electronics Integrated with Photonics in 3-D on Silicon Chip

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Breck Hitz

Researchers at the University of California, Los Angeles, have realized the three-dimensional integration of electronics and photonics in a monolithic silicon-on-insulator substrate. The photonic device was buried inside the silicon, while a metal-oxide semiconductor field-effect transistor (MOSFET) was on the surface. The investigators had previously demonstrated the buried photonic device (see “Photonics Goes Underground in Silicon,” Photonics Spectra, October 2005, page 18) but until now had been unable to fabricate operational electronics on the same device. An optical micrograph shows...Read full article

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    Published: January 2006
    monolithic silicon-on-insulator substrateResearch & TechnologyUniversity of California

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