In Germany, MST.factory dortmund of Munich, which provides support for companies in the micro- and nanotechnology fields, has purchased a CB8 high-performance wafer bonder from SUSS MicroTec of Garching. The device is being used to develop processes for state-of-the-art advanced MEMS wafer bonding techniques, particularly for Cu-Cu, Au-Au and Al-Al. The CB8 was chosen for its ability to run eutectic, fusion and metal diffusion processes, among others.