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EVG Unveils New Wafer Bonder

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ST. FLORIAN, Austria, July 27, 2010 — EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced that it has introduced the EVG560HBL wafer bonder. According to the company, it’s the industry’s first fully automated wafer bonding system for high-brightness light-emitting diode (HB-LED) manufacturing. The system features a new design for multisubstrate bonding and is capable of throughput rates of 160 bonds per hour. It is optimized to meet the requirements of HB-LED manufacturers with the automation capabilities that they will need to...Read full article

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    Published: July 2010
    Glossary
    lithography
    Lithography is a key process used in microfabrication and semiconductor manufacturing to create intricate patterns on the surface of substrates, typically silicon wafers. It involves the transfer of a desired pattern onto a photosensitive material called a resist, which is coated onto the substrate. The resist is then selectively exposed to light or other radiation using a mask or reticle that contains the pattern of interest. The lithography process can be broadly categorized into several...
    nano
    An SI prefix meaning one billionth (10-9). Nano can also be used to indicate the study of atoms, molecules and other structures and particles on the nanometer scale. Nano-optics (also referred to as nanophotonics), for example, is the study of how light and light-matter interactions behave on the nanometer scale. See nanophotonics.
    nanotechnology
    The use of atoms, molecules and molecular-scale structures to enhance existing technology and develop new materials and devices. The goal of this technology is to manipulate atomic and molecular particles to create devices that are thousands of times smaller and faster than those of the current microtechnologies.
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