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SMIC Achieves Sensor Breakthrough

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SHANGHAI, Jan. 8, 2013 — Semiconductor Manufacturing International Corp. (SMIC) has announced a breakthrough in its development of backside-illuminated CMOS image sensor (CIS) technology for mobile phone cameras, with the first test chip demonstrating good image quality even in low-light conditions. The complete backside-illuminated (BSI) process development allows SMIC to broaden its CMOS image sensor foundry service offerings to customers with 5-megapixel and higher resolution phone cameras and high-performance video camera products. The company says that BSI sensors are more light-sensitive than...Read full article

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    Published: January 2013
    Asia-Pacificbackside-illuminated CMOS image sensorsBSIBusinesscamerasChinaCIS technologyCMOSfrontside-illuminated CMOS sensorsimage sensorsImagingindustrialSemiconductor Manufacturing International Corp.Sensors & DetectorsShanghaismartphone imagesSMIC

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