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Ultrafast Lasers Enable Improvements in Microprocessing

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Tim Gerke, Fianium Inc.

Ultrafast lasers provide an avenue into a number of new microprocessing applications because of their capability for athermal ablation and their extremely high peak power. Many materials and applications can be susceptible to adverse heating effects such as melting, peeling, chipping, melt splatter and substrate damage when processed with CW and long-pulse lasers. With picosecond and femtosecond lasers, however, these undesirable side effects can be mitigated or eliminated completely. In addition to decreasing heating effects, using ultrashort pulse widths can increase process efficiency and...Read full article

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    Published: January 2015
    Featuresfiber lasersLasersMaterialsindustrialAmericasultrafast lasersmicroprocessing applicationsathermal ablationultrashort pulse widthchipping defectmelting defectmicrocrackingHylaseFianiumTim Gerke

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