TAUNTON, Mass., June 27 -- Kopin Corp., an innovator and manufacturer of flat panel display products and HBT wafers, is implementing a two-for-one stock split set to take place on June 30. The split will come in the form of a stock dividend, the company said. The transfer agent will mail certificates on or near July 12 representing one extra share of Kopin stock for each share held as of June 30. The move will increase shares of Kopin common stock from about 30,000,000 shares to 60,000,000 shares. Kopin's telecommunications and digital imaging applications products strengthen the delivery and presentation of video, voice and data, the company said. Kopin's HBT wafers are used in wireless digital phones, and its gigabit circuits are used for fiber optic and Internet data transmission.