Search
Menu
Rocky Mountain Instruments - Laser Optics LB

Two-Photon Imaging Offers Backside Peek at Chips

Facebook X LinkedIn Email
Single-photon, optical beam-induced- current imaging is a valuable tool for the quality control of integrated circuits. However, this technique has become increasingly ineffective because of the large number of layers added to the front side of the modern chip. Scientists at Bell Laboratories in Murray Hill, N.J., have developed a two-photon process that can image through the back side of a chip without thermal absorption. In the process, a mode-locked Ti:sapphire laser "blasts" and polishes the back end of the chip. The team could view the components of a Hitachi 256 3 4k SRAM chip at around...Read full article

Related content from Photonics Media



    Articles


    Photonics Handbook Articles


    Media
    Published: July 1997
    Research & TechnologyTech Pulse

    We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.