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FINETECH
560 E Germann Rd. #103
Gilbert, AZ 85297
United States
Phone: +1 480-893-1630
Submicron bonders for photonics packaging and die attach. Bonding of laser bars and diodes, VCSELs, silicon photonics, sensors, flip chip, LEDs, transceivers, lidar devices. Systems provide high process flexibility in one platform; manual, motorized, and automated models for a variety of bonding applications.
Established: 1992
Ownership type: Privately Owned
Green Manufacturing Green Manufacturing
Green Facility Green Facility

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