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FAST-CURING EPOXY

Photonics Spectra
Oct 2001
Emerson & Cuming Microwave Products Inc.
 
A medium-viscosity epoxy glob top from Emerson & Cuming provides suitable adhesion to flexible and rigid polymeric substrates, including gloss or matte epoxy, polyester and polyimide. The new 50400-1 is recommended for chip-on-board applications such as smart-card modules. The epoxy can cure in 30 min. at 120 °C in a convection oven or in 5 min. at 120 to 130 °C in an IR oven, resulting in lower stress on the substrate. The one-component system requires no mixing or weighing and can be applied with manual or automatic dispensing equipment.


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