850-nm VCSEL
Philips Technologie GmbH U-L-M PhotonicsRequest Info
Transsub, an 850-nm VCSEL design grown as a bottom emitter with topside P and N contacts, emits in the direction of the substrate. Available from Ulm photonics GmbH, the VCSEL for direct flip chip has a mechanical robust surface on the emitting side, and contacts on the opposite allow easy assembly of single devices and arrays. On the wafer scale, a 100- to 300-µm-thick transparent glass substrate can replace the gallium arsenide. The design accommodates integrating lenses and fiber alignment marks by stacking additional wafers. Applications include very short reach interconnects and automotive datacom.
http://www.ulm-photonics.de
/Buyers_Guide/Philips_Technologie_GmbH_U-L-M_Photonics/c15359
Published: December 2003
REQUEST INFO ABOUT THIS PRODUCT
* First Name:
* Last Name:
* Email Address:
* Company:
* Country:
Message:
When you click "Send Request", we will record and send your personal contact information to Philips Technologie GmbH U-L-M Photonics by email so they may respond directly. You also agree that Photonics Media may contact you with information related to this inquiry, and that you have read and accept our
Privacy Policy and
Terms and Conditions of Use.
Register or login to auto-populate this form:
Login
Register
* Required