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Photonics Spectra
Feb 2004
Rudolph Technologies Inc.Request Info
Expert application system (Easy) software released by Rudolph Technologies Inc. enhances the capabilities of the company's MetaPulse and MetaPulse-II opaque film metrology line to cover 90-nm chip manufacturing processes. The software is suitable for applications including in-line electroplate edge profiling, residual copper/barrier detection after chemical mechanical planarization, and copper/interlevel dielectric dishing. Manufacturers can detect defects during production to avoid reduced yield of chips on the wafer's edge and to prevent chemical mechanical planarization-related problems. If planarization does occur, the system checks for traces of residual copper and barrier, preventing the copper lines from shorting together, which would produce a defective die. Easy also determines whether the measurement site consists of copper or interlevel dielectric dishing and applies the appropriate model for each.


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barrier detectionelectroplate edge profilingindustrialmetrologyNew Productsopaque film metrologyresidual copperRudolph Technologies Inc.

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