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SUBSTRATE POLISHERS

Photonics Spectra
May 2004
Engis UK Ltd.Request Info
 
SUBSTRATE POLISHERS Engis (UK) Ltd. offers the Microtech CMP-D polishing systems for the surface planarization and polishing of compound semiconductor, sapphire, silicon carbide and other substrates. The polishers employ graded micron-scale diamond in specially formulated slurries. The company says that the equipment requires shorter processing times and uses less-expensive, less-toxic and fewer consumables than traditional approaches, resulting in higher productivity, lower costs and simpler processing.


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