Close

Search

Search Menu
Photonics Media Photonics Buyers' Guide Photonics EDU Photonics Spectra BioPhotonics EuroPhotonics Industrial Photonics Photonics Showcase Photonics ProdSpec Photonics Handbook
More News
share
Email Facebook Twitter Google+ LinkedIn

LED WAFER SCRIBING

Photonics Spectra
Jan 2005
IPG Photonics, Microsystems Div.
 
LED WAFER SCRIBING JPSA Laser has announced 2.5-µm LED dicing kerfs that achieve a 50% reduction in cut widths to increase both die yield per wafer and throughput. The narrower scribe is characterized by a sharper V-groove profile that allows a shallower cut to break more readily and to increase the wafer-per-hour specification. Specially configured UV diode-pumped solid-state laser system optics are used to achieve the narrower cuts. The company says that process improvements are the result of the enhanced laser and optics, as well as the ability to manipulate subtle optical effects to achieve a small on-target energy distribution with a lower heat-affected zone, while maintaining a long working distance and depth of field.


MORE FROM PHOTONICS MEDIA
UV diode-pumped solid-state laser system
JPSA Laser
industrialJPSA LaserLED dicing kerfsNew ProductsUV diode-pumped solid-state laser systemWafers

Terms & Conditions Privacy Policy About Us Contact Us
back to top
Facebook Twitter Instagram LinkedIn YouTube RSS
©2018 Photonics Media, 100 West St., Pittsfield, MA, 01201 USA, info@photonics.com

Photonics Media, Laurin Publishing
x Subscribe to Photonics Spectra magazine - FREE!
We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.