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TE ASSEMBLY PROCESS

Photonics Spectra
Jun 2005
Avo PhotonicsRequest Info
 
TE ASSEMBLY PROCESS A lead-free TEC-to-Package assembly process has been developed by Avo Photonics. It includes solder bonding of the thermoelectric (TE) cooler within a nonoxidizing inert gas environment that results in void-free coverage. Surface acoustic microscopy testing verifies void-free results. The company says that the process produces good thermal conductivity across the interface as well as rugged bond strengths. For TE coolers that don't have wire-bond posts, the company trims, forms and simultaneously reflows the solder to bond the leads to the package.


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