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M-Lock Wafer Bonder
Jul 2006
SUSS MicroTec Inc.Request Info
WATERBURY CENTER, Vt., July 24, 2006 -- Suss MicroTec, a supplier of precision manufacturing and test equipment to the semiconductor industry, has introduced M-Lock, a wafer-bonding system designed for high vacuum applications. In what the company said is an industry-first, this field-upgradeable, load-locked wafer-bonding system was developed by Suss MicroTec for advanced MEMS (microelectromechanical systems) devices that require ultraclean, low moisture and low contamination vacuum bonding.

SussWaferbonder.jpgIn addition, M-Lock is well suited for MEMS devices with on-chip getters, such as silicon gyros and other advanced MEMS products, the company said.

Wafer-level packaging using wafer-bonding technology is a critical step in MEMS manufacturing today. The M-Lock system furthers the process technology for wafer-bonded MEMS sensors and devices that require on-chip high vacuum or an ultraclean wafer-bonding environment for high performance and high reliability products. This is achieved by maintaining high vacuum in the bonder chamber at all times by means of a secondary load-lock chamber and by heating the vacuum chamber walls to reduce the effect of outgassing during wafer bonding, Suss said.

“We believe only Suss can offer load-locked systems for advanced MEMS device fabrication, because of the fundamental design philosophy of our wafer bonders. In addition to the ultraclean high vacuum, low outgassing process performance improvements that this system will provide, we also expect significant productivity gains for our customers,” said Amir Mirza, international product manager of Suss’ Wafer Bonder Div. in Waterbury.

The system will be available in the third quarter of 2006; it was demonstrated for the first time at Semicon West earlier this month in San Francisco. For more information, visit:; e-mail:

Suss MicroTec Inc.
228 Suss Dr.
Waterbury Center, VT 05677
Phone: (802) 244-5181
Fax: (802) 244-5103


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