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DSM200 MEMS Metrology System
May 2007
SUSS MicroTec AGRequest Info
GARCHING, Germany, May 3, 2007 -- With the DSM200, microelectronics and test systems maker Suss MicroTec AG said it has developed an automated metrology system for all emerging front-to-back alignment applications.

SussMicrotecDsm200.jpgAccording to the company, the cassette-cassette, front-to-back alignment metrology system is the ideal tool for verifying alignment accuracy on wafers from 2 in. to 200 mm. Incorporating state-of-the-art pattern recognition technology, the DSM200 offers the highest measurement accuracy of 0.2 µm at 3 σ on a fully automated platform with minimized operator intervention.

Based on the latest production platform of the Suss MA200 compact mask aligner, the DSM200 provides reliable and accurate metrology for double-sided alignment and exposure applications frequently used in the manufacturing of MEMS (microelectromechanical systems) devices, power semiconductors and optoelectronics.

"We believe the DSM200 offers a value-engineered measurement solution exceeding the metrology requirements for the majority of double-sided aligned and exposed production applications," said Rolf Wolf, managing director of Suss MicroTec’s lithography division.

For more information, visit:

Suss MicroTec AG
Schleissheimer Str. 90
D 85748 Garching
Phone: +49 89 32007 0
Fax: +49 89 32007 162


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DSM200industriallithographyMEMSmetrologymicroelectronicsnanooptoelectronicsphotonicsProductsRolf WolfsemiconductorsSussSuss MicroTectest systemsWafers

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