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100-mm Sapphire Wafer Dicing
Jul 2007
IPG Photonics, Microsystems Div.
For Higher LED Production
MANCHESTER, N.H., July 24, 2007 -- JP Sercel Associates (JPSA) now has 100-mm sapphire wafer dicing capability, developed with its IX-200 Chromadice DPSS (diode-pumped solid-state) ultraviolet laser wafer singulation system. The ability to process larger sapphire wafers means higher yields for LED manufacturers, said Jeffrey P. Sercel, president.

“Our Chromadice system can process four 100-mm wafers per hour, compared to the previous 10 two-in. wafers per hour,” he said. “Since each 100-mm wafer has four times as many die as a two-in. wafer, a typical customer will now be cutting the equivalent of 16 two-in. wafers per hour, per Chromadice system. That represents a dramatic increase in yields.”

The IX-200 ChromaDice is a high-precision wafer dicing (singulation) system that is also suitable for wafer trimming and scribing applications. Its UV DPSS laser system delivers high-speed wafer dicing and cutting with typical yields greater than 99 percent at less than $2 per wafer. The process is tolerant of wafer warp and bow and is suitable for all wafer types.

The IX-200 system is also available in an excimer laser version for via drilling, micromachining, thin-film patterning and many other semiconductor packaging applications, including LED liftoff.

New high-accuracy Z-theta-capable, air-bearing stages make the larger wafer processing possible, Sercel said. “The IX-200 easily cuts the larger wafers without impinging on the 20-µm streets.”

The integrated Z-theta motorized stage boasts noncontact operation, as opposed to typical worm and wheel rotary designs. In addition to offering high-precision operation, the new Z-theta stage provides 360° of rotational capability, and its Z-axis capability, with the ability to accommodate wafers of varying thicknesses and diameters, makes it applicable to a wide variety of applications. Advantages of the new rotary stage include continuous or limited travel, accuracy and repeatability, a cog-free motor for smooth motion, zero gear backlash, low wobble and bearing runout, and no accuracy changes over time due to gear wear.

The Class 1, fully enclosed IX-200 ChromaDice is available in 266 or 355 nm UV-DPSS laser wavelengths for a wide range of process capabilities; it can achieve cuts as narrow as 2.5-µ wide, yielding as much as 24 percent more die per wafer with die yields of more than 99 percent. It delivers excellent results on GaAs, Si and other materials.

For more information, visit:

220 Hackett Hill Rd.
Manchester, NH 03102
Phone: (6030 518-3200
Fax: (603) 518-3298

diode-pumped solid-state
100-mm sapphire wafer dicingChromadice DPSSdiode-pumped solid-stateindustrialJP Sercel AssociatesJPSAlaser waferphotonicsProductsultraviolet

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