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HEAT SINKS

Photonics Spectra
Aug 2007
LEW TechniquesRequest Info
 
LEW Techniques.jpgLEW Techniques Ltd. is offering laser diode heat sinks with supersharp edges, flat and smooth die bonding surfaces, and optional predeposited gold/tin solder to enable positioning of high-power laser diodes right to the edge of the mount to minimize hot spots and voiding. C-mounts are fabricated from copper with optional expansion-compensating tungsten/copper inserts in the laser bonding area for maximum thermal conductivity. Smaller Q- and W-mounts can be fabricated completely from tungsten/copper, and strongly attached standoff ceramics, with or without tags, also are available.


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