Avia UV Laser
Coherent Inc.Request Info
For High-Speed IC Die Singulation
SANTA CLARA, Calif., April 1, 2008 -- Coherent Inc. said its new Avia 355-23-250 offers the highest pulse-repetition rate of any Q-switched ultraviolet laser, making it the optimum solution for high-speed integrated circuit (IC) die singulation with high yields.
The new laser can deliver over 8 W of 355-nm output at repetition rates of 250 kHz and higher, Coherent said. The combination of high average power and high pulse repetition rate translates directly into high process throughput with minimal silicon microcracking.
Coherent said the output flexibility of the Avia 355-23-250 is also unique, making it the only laser that can provide output tailored for both scribing and dicing. PulseEQ allows the laser to deliver low pulse energy at a 250-kHz repetition rate, which is ideal for gently scribing through the thin (typically 10 µm) epitaxial circuitry layers. Yet the same laser can also be operated at lower repetition rates, with pulse energies as high as 80 J for dicing (cutting) through the wafer itself.
Because of fully automated active-optimization functions such as PulseEQ, ThermEQ and PosiLock, the pulse-repetition rate and pulse energy can be rapidly changed with no effect on the laser's beam quality (M2 less than 1.3), high pulse to pulse energy stability (noise less than 5 percent rms at 70 kHz), and beam pointing, the company said.
The Avia 355-23-250 is the ideal tool for high-throughput micromachining applications, such as scribing low-k semiconductors, dicing thin memory chips, and via hole drilling in printed circuit boards. Other applications include solar cell micromachining and direct patterning of thin films, Coherent said.
For more information, visit: www.coherent.com; e-mail: [email protected]Coherent Inc.
5100 Patrick Henry Dr.
Santa Clara, CA 95054
Phone: (408) 764-4000
Fax: (408) 764-4800
https://www.coherent.com
/Buyers_Guide/Coherent_Inc/c2706
Published: April 2008
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