BONDER
FINETECH GmbH & Co. KGRequest Info
Finetech GmbH & Co. KG has expanded its Fineplacer product line with the introduction of the Fineplacer Femto, an automated submicron bonder for assembly of optoelectronic components. It can be used to assemble and bond laser bars and diodes, flip chips, VCSELs, MEMS, sensors, micro-optics, surface-mount photonics and simple die attach. The 1270 × 900-mm system exhibits accuracy of ±5 μm. Features include a large working area, and automatic pattern recognition and alignment based on motorized X, Y, Z and theta movements. Processes are automatically controlled and do not require operator intervention during alignment and bonding. The device is designed for use in production environments and in product and process development.
https://www.finetech.de
/Buyers_Guide/FINETECH_GmbH_Co_KG/c4948
Published: April 2008
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