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Photonics Spectra
Nov 2008
SUSS MicroTec AGRequest Info
Suss MicroTec AG has released the third generation of its manual mask and bond aligner for industrial research and production applications. MA/BA8 Gen3 offers alignment accuracy down to <0.25 μm and easily processes virtually all kinds of wafer and substrate materials up to 200 mm. The high-resolution optics enables patterning of structures below 0.5 μm. The split-field microscope and eyepieces allow direct viewing and/or LCD flat screen options.


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bond alignerindustrialmanual maskMicroscopyNew ProductsSuss MicroTec AG

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