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Photonics Spectra
Jan 2009
LPKF Laser & Electronics AGRequest Info
LPKF_Laser.jpgThe MicroLine 6000 P ultraviolet laser cutting system has been introduced by LPKF Laser & Electronics AG for stress-free cutting of flexible, rigid and rigid-flex substrates, including metals, plastics and ceramic materials. The 355-nm diode-pumped solid-state laser operates at a repetition rate from 10 to 100 kHz. The system has a working area of 610 × 457 × 50 mm, and constant scan technology enables cutting while moving the scanner. A high-speed linear positioning system and a drift-compensated scanning head are included.


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ceramic materialsindustrialLPKF Laser & Electronics AGNew Productsultraviolet laser cutting system

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