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Secured Diamond Saw Wire

Photonics Showcase
Sep 2010
Niabraze LLCRequest Info
High-tensile-strength fixed-grain diamond saw wire for cutting precious, hard materials with minimal material kerf loss. Wire diameter ranging from 140 to 350 μm for applications ranging from wafering to sampling to cropping. Diamond concentricity and density carefully controlled to ensure efficient free cutting. Slurry-free cutting of silicon, sapphire, quartz, germanium, SiC, ceramics and many more materials.


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