EP30FLAO Low-Viscosity Epoxy
Master Bond Inc.Request Info
Master Bond Inc.’s EP30FLAO is a two-component epoxy resin system for potting, bonding, sealing and coating. It can be used in a variety of cryogenic applications.
This low-viscosity epoxy with good flow characteristics makes it a thermally conductive potting compound. It is widely used in the electronic, electrical, computer, metalworking, appliance and chemical industries where electrical insulation, environmental protection and heat transfer are required.
It is formulated to cure at room temperature or, more rapidly, at elevated temperatures, with a 10:1 mix ratio by weight. It is an effective adhesive/sealant that forms durable and flexible bonds that are resistant to thermal cycling and to chemicals including water, oil and most organic solvents.
Service temperature range is from -51 to 121 ºC. Thermal conductivity is 9 to 10 BTU/in/ft²/hr/º F. The viscosity of the mixed compound is 5000 to 6000 centipoise at 24 º C. The epoxy has a low thermal expansion coefficient, good dimensional stability, and good physical strength and toughness.
Parts A and B are available in half-pint, pint, quart, and 1- and 5-gal containers.
https://www.masterbond.com
/Buyers_Guide/Master_Bond_Inc/c9086
Published: August 2010
REQUEST INFO ABOUT THIS PRODUCT
* First Name:
* Last Name:
* Email Address:
* Company:
* Country:
Message:
When you click "Send Request", we will record and send your personal contact information to Master Bond Inc. by email so they may respond directly. You also agree that Photonics Media may contact you with information related to this inquiry, and that you have read and accept our
Privacy Policy and
Terms and Conditions of Use.
Register or login to auto-populate this form:
Login
Register
* Required