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Thermoelectric Modules eTEC Series
Jul 2012
Laird TechnologiesRequest Info
ST. LOUIS, July 31, 2012 — The eTEC series thermoelectric modules from Laird Technologies Inc. enable high-power optoelectronics and laser diodes to maintain peak performance by stabilizing the temperature of the devices during operation. They are assembled using thin-film technology that provides 10 times more heat pumping density per unit area than conventional bulk thermoelectric technology delivers. The ceramic substrates are gold-metallized to allow them to be embedded into densely packed optoelectronics.

The modules’ heat-pumping densities range from 75 to 90 W/cm2 at an ambient temperature of 25 °C. The new models include:

HV14, 18, F0, 0101, GG – 1.4 W in 1 mm2
HV37, 48, F2, 0202, GG – 3.7 W in 6.9 mm2
HV56, 72, F2, 0203, GG – 4.8 Win 10.2 mm2

Constructed with bismuth telluride thin-film technology and thermally conductive aluminum nitride ceramics, the modules are designed for higher voltage and lower, sub-10-W heat pumping applications. Other features include RoHS-compliance, pending Telcordia-compliance and gold metallization for soldering to substrate surfaces.

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