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Superfast 3G In-Line Wafer Inspection System
Nov 2012
Ultratech/CNTRequest Info
SAN JOSE, Calif., Nov. 28, 2012 — Ultratech Inc. has introduced its in-line wafer inspection system, the Superfast 3G, for improved overlay control and enhanced yield. It can be implemented at the front, middle or back of the production line.

Based on patented coherent gradient sensing (CGS) technology, the system provides high wafer resolution and measures >800,000 points of data per wafer. Its high data density enables a variety of applications from one measurement. Within-die, die-to-die and wafer-to-wafer process variations can be characterized quickly and comprehensively. It has an edge-exclusion capability of <2mm.

The Superfast 3G takes a large amount of data in a short span of time and creates detailed wafer maps. Without the need for a dedicated target, it can measure patterned and blanket wafers at any stage in the process flow. CGS technology lets customers use a single type of wafer inspection tool across the entire fab line.


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Americasblanket wafersCaliforniaCGS technologycoherent gradient sensing technologydie-to-dieedge exclusionin-line wafer inspectionoverlay controlpatterned wafersProductsSuperfast 3GTest & MeasurementUltratechwafer mapswafer-to-waferwithin-die

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