Search Menu
Photonics Media Photonics Buyers' Guide Photonics EDU Photonics Spectra BioPhotonics EuroPhotonics Industrial Photonics Photonics Showcase Photonics ProdSpec Photonics Handbook
More News
Email Facebook Twitter Google+ LinkedIn

Superfast 3G In-Line Wafer Inspection System
Nov 2012
Ultratech/CNTRequest Info
SAN JOSE, Calif., Nov. 28, 2012 — Ultratech Inc. has introduced its in-line wafer inspection system, the Superfast 3G, for improved overlay control and enhanced yield. It can be implemented at the front, middle or back of the production line.

Based on patented coherent gradient sensing (CGS) technology, the system provides high wafer resolution and measures >800,000 points of data per wafer. Its high data density enables a variety of applications from one measurement. Within-die, die-to-die and wafer-to-wafer process variations can be characterized quickly and comprehensively. It has an edge-exclusion capability of <2mm.

The Superfast 3G takes a large amount of data in a short span of time and creates detailed wafer maps. Without the need for a dedicated target, it can measure patterned and blanket wafers at any stage in the process flow. CGS technology lets customers use a single type of wafer inspection tool across the entire fab line.


* Message:
(requirements, questions for supplier)
Your contact information
* First Name:
* Last Name:
* Email Address:
* Company:
Address 2:
Postal Code:
* Country:
Phone #:
Fax #:

Register or login to auto-populate this form:
Login Register
* Required

When you click "Send Request", we will record and send your personal contact information to Ultratech/CNT by email so they may respond directly. You also agree that Photonics Media may contact you with information related to this inquiry, and that you have read and accept our Privacy Policy and Terms and Conditions of Use.
Americasblanket wafersCaliforniaCGS technologycoherent gradient sensing technologydie-to-dieedge exclusionin-line wafer inspectionoverlay controlpatterned wafersProductsSuperfast 3GTest & MeasurementUltratechwafer mapswafer-to-waferwithin-die

Terms & Conditions Privacy Policy About Us Contact Us
back to top
Facebook Twitter Instagram LinkedIn YouTube RSS
©2018 Photonics Media, 100 West St., Pittsfield, MA, 01201 USA,

Photonics Media, Laurin Publishing
x We deliver – right to your inbox. Subscribe FREE to our newsletters.
Are you interested in this product?
When you click "Send Request", we will send the contact details you supply to Ultratech/CNT so they may respond to your inquiry directly.

Email Address:
Stop showing me this for the remainder of my visit
We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.