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Excimer Laser Stepper

Jun 2014
SUSS MicroTec AGRequest Info
GARCHING, Germany, March 4, 2014 — Suss MicroTec has launched the ELP300 Gen2, an excimer laser stepper that enables the creation of smaller via sizes (<5 µm) and decreased via pitch for advanced packaging and 3-D processing applications.

Using excimer laser ablation allows alternative organic polymers that contain enhanced mechanical, physical, thermal and chemical properties to be used to lower cure temperatures and coefficient thermal expansion (CTE) stresses.

Configured for 200- and 300-mm wafers, the device addresses the limitations of traditional photolithography and photo-dielectric steppers.


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chemicalsCTEDisplaysEuropeGermanylaserslight sourcesopticsorganic polymerspackaging applicationsphotolithography steppersProductsSuss MicroTecWafersexcimer laser stepperELP300 Gen2via sizesvia pitch3-D processing applicationsexcimer laser ablationcoefficient thermal expansioncure temperaturesphoto-dielectric steppers

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