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3D Color Stereoscopic Camera
Aug 2017
Chromasens GmbHRequest Info
KONSTANZ, Germany, Aug. 30, 2017 — 3D Color Stereoscopic CameraThe 3DPIXA 3D color stereoscopic camera from Chromasens GmbH is designed for the automated optical inspection of equipped and unequipped printed circuit boards.

By combining 2D and 3D visualizations in a single camera, the 3DPIXA is suitable for printed circuitboards with elevations of different heights. It features an optical resolution of 5 µm for 2D color visualization and of 1 µm for 3D image capture. High resolution is a basic requirement for the inspection of wire bonds with a thickness of <1 mm. High-speed 3D algorithms identify the wire connections in the generated stereo images, eliminating parallax errors and forming the basis to calculate precise connection heights.

Defective soldering, foreign particles or possibly faulty positioning of components can also be automatically detected. Laser markings can be identified by using integrated dark-field lighting. Chromasens' flexible 3D-API gives engineers simplified control of all camera functions as well as faster integration of the automated optical inspection function into existing vision applications.


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Products3DPIXA3D Color Stereoscopic Cameraimaging3DChromasensEurope

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