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Laser Selective Soldering Systems
Jan 2018
Seica SpARequest Info
STRAMBINO, Italy, Jan. 26, 2018 — Laser Selective Soldering SystemsThe Firefly Next > series of laser selective soldering systems from Seica SPA is capable of soldering both the top and bottom of the printed circuit board.

Under its new housing made of steel and other premium materials, the Firefly features a high-efficiency laser source, a new spot angle on the board, a fully programmable doughnut spot size and axial integration.

Utilizing vision and continuous temperature feedback of the solder joint during the solder process provides an outstanding throughput in terms of applicability and reliability compared to the past generation and current competitors.


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