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Systems-On-Chip Interconnect Solutions

Photonics.com
Mar 2018
MaxLinear Inc.Request Info
 
CARLSBAD, Calif., March 1, 2018 — The Telluride MxL935XX series of 400-Gbps pulse-amplitude-modulation (PAM4) digital signal processing (DSP) systems-on-chip (SoC) solutions from MaxLinear Inc. are designed for the high-speed optical interconnect needs of megascale cloud and enterprise data centers.

The MxL935XX device allows system vendors to develop a 400-Gbps optical interconnect module in a compact form factor for intradata center applications with a transmission distance up to 2 km. They are capable of one, two or four lanes of 100-Gbps optical connectivity combined with a flexible 25-G NRZ and 50-G PAM4 electrical interface.

The MxL935XX 16-nm CMOS PAM4 DSP SoC consumes an extremely low power of 6.7 W, which includes the integrated EA-EML driver power dissipation. The minimal power consumption of the MxL935XX meets the stringent power constraints of 400-Gbps optical module form factors.


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ProductsSystems-On-Chip Interconnect SolutionsCommunicationsTellurideMxL935XXoptics

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