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Cleaning Technology

Photonics.com
Apr 2018
3D-Micromac AGRequest Info
 
CHEMNITZ, Germany, April 9, 2018 — Clean Scribe technology from 3D-Micromac AG is a feature for its microDICE laser micromachining system that enables particle-free scribing of silicon carbide (SiC) wafers without the need for expensive coatings and without impacting wafer dicing throughput.

Clean Scribe works seamlessly with 3D-Micromac's TLS-Dicing (thermal-laser-separation) process with integraton in the microDICE system to provide fast, damage-free, and cost-effective wafer dicing with no additional material or equipment overhead.

Clean Scribe replaces the dry scribe approach with an aerosol spray that uses an extremely small amount of deionized water to wash away the particles during the laser processing step. The technology provides dicing speeds of up to 300 mm/s.


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ProductsClean Scribecleaning technology3D-MicromacmaterialsEurope

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