Request InfoPlan Optik AGPlan Optik GmbH has developed structuring and polishing methods for glass and fused silica wafers. The ultrasonic high-speed drilling method can be used for prototypes and for high-volume production. It replaces ultrasonic drilling and, according to the company, provides improved tolerances and process performance. The polishing technique, which is almost free of microdamage, prepares substrates for etching. The wafers have a minimum thickness of 80 µm and a maximum diameter of 12 in.See full productRelated content from Photonics MediaWEBINARSPhotonics.com 10/27/2021Fiber Optic Solutions for Medical DevicesSteve Allen provides a brief overview and examples of procedures that continue to push adoption and proliferation of optical fiber-based medical devices. From cosmetic surgery to cutting-edge sensing...Photonics.com 3/7/2019In Vivo Medical Laser Procedures: An OverviewThis webinar, presented by OFS, will provide an overview of current in vivo medical procedures performed using lasers and optical fibers. The presentation will begin with a brief history of...Photonics.com 7/22/2021STANDARDS UPDATE: Vision Standards: An Overview of Global and A3 DevelopmentsStandards play a key role in the vision and imaging industry by ensuring interoperability of components, increasing market size, and shortening the time it takes to get new products to market. As the...Photonics.com 6/30/2021European Photonics Manufacturing Services Funded by ECThis event is supported by the European initiatives presented and is moderated by EPIC, the European Photonics Industry Consortium. The European Commission is helping companies access the...