Request InfoWolfspeed Inc.Cree Inc. has unveiled its XThin next-generation solid-state high-intensity LED emitters that combine InGaN materials with a proprietary silicon carbide substrate. The vertically structured LED chips measure 115 µm high and require low forward voltage and a single wire bond connection. They have a geometrically enhanced epi-down design that maximizes light extraction efficiency for improved white light conversion. The chips are tested for conformity to optical and electrical specifications and for the ability to withstand 1000-V electrostatic discharge. Applications include use in the...See full productRelated content from Photonics MediaPRODUCTSPhotonics Spectra January 2023 IssueLED Tube Light ModuleThe Corona II LED Combined Tube Light Module from Chromasens GmbH is a line scan platform for product inspection. 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