Henkel AdhesivesHysol FP4548FC is a high-purity liquid epoxy encapsulant material from Henkel Corp.s Electronics Div. that is designed as an underfill for flip-chip devices that require crack and fracture resistance. Its low coefficient of thermal expansion and low shrinkage properties make it suitable for low k die applications. When fully cured, the material creates a rigid, high-strength seal that dissipates solder joint stress, extends thermal cycling performance and simplifies assembly. It is compatible with lead-free manufacturing requirements and is qualified for JEDEC Level 3/260 °C.See full productRelated content from Photonics MediaPRODUCTSPhotonics.com 11/21/2022CMOS CamerasThe Genie™ Nano-10GigE M/C8200 and M/C6200 CMOS cameras from Teledyne DALSA are based on Teledyne e2v’s 67M and 37M monochrome and color sensors. 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To bridge the gap between these technologies,...Photonics Spectra June 2022 IssueIndustrial Femtosecond Laser Advancements Power Next-Generation ApplicationsCommercial use of ultrashort-pulse lasers, and femtosecond pulsed lasers in particular, continues to rise, due to the ability of these sources to cleanly ablate material or tissue with minimal...PHOTONICS HANDBOOK ARTICLESPhotonics HandbookNanopositioning: A Step AheadBy its original definition, a nanopositioning device is a mechanism capable of repeatedly delivering motion in increments as small as one nanometer. Lately demands from industry and research have...Photonics HandbookPhotonics Packaging: Optical Communication ComponentsPhotonic components are key elements for the information technology (IT). 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