Search
Menu
PI Physik Instrumente - Revolution In Photonics Align ROSLB 3/24

Custom Optoelectronic Assemblies

Facebook X LinkedIn Email
Request Info
Teledyne Advanced Electronic Solutions
Teledyne Microelectronics develops advanced microelectronics packaging for high-speed broadband communications, including fiber optic transmitters, receivers, multichannel transceivers and optical assemblies. The company provides low-, medium-, or high-volume miniature optoelectronic packaging design, assembly and test. It specializes in packaging ultradense microminiature devices on a variety of substrates, including LTCC, HTCC and thick/thin film. Advanced packaging techniques include flip chip, chip scale, BGA, SMT and mixed-mode manufacturing; it is ISO 9001:2000 and MIL-PRF-38534...See full product

Related content from Photonics Media



    PRODUCTS


    ARTICLES


    PHOTONICS HANDBOOK ARTICLES


    WHITEPAPERS


    WEBINARS


    PHOTONICS DICTIONARY+ TERMS


    VIDEOS


    PHOTONICS BUYERS' GUIDE CATEGORIES


    COMPANIES


    We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.