Request InfoSUSS MicroTec Inc.WATERBURY CENTER, Vt., July 24, 2006 -- Suss MicroTec, a supplier of precision manufacturing and test equipment to the semiconductor industry, has introduced M-Lock, a wafer-bonding system designed for high vacuum applications. In what the company said is an industry-first, this field-upgradeable, load-locked wafer-bonding system was developed by Suss MicroTec for advanced MEMS (microelectromechanical systems) devices that require ultraclean, low moisture and low contamination vacuum bonding. In addition, M-Lock is well suited for MEMS devices with on-chip getters, such as silicon gyros and other advanced MEMS products, the...See full productRelated content from Photonics MediaPRODUCTSPhotonics Spectra December 2023 IssueMEMS Autofocus ActuatorThe MEMS Autofocus Actuator for Active Athermalization in Embedded Vision Cameras from Sheba Microsystems Inc. was made to be used in automotive, action, drones, machine vision, security and...Photonics.com 3/11/2024Clamp MeterThe FLIR CM276 from Teledyne FLIR is a clamp meter that combines thermal imaging with electrical measurement for inspecting and troubleshooting electrical systems, solar panels, pumps, and motors....Photonics.com 7/10/2023Positioning SystemThe Bluetooth Low Energy (Bluetooth LE) solution from onsemi is an end-to-end positioning system that enables simple, fast development of cost- and power-efficient asset tracking solutions. 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