Request InfoBerliner Glas GmbHBerliner Glas KGaA announces structured glass wafers for interposer and encapsulating microparts in MEMS and MOEMS for industrial applications. The wafers are composed of borosilicate glass and are available in sizes up to 8 in. They offer alignment marks; bonding readiness; optically clear surfaces; thermal coefficiency of expansion adapted to the wafer; tight form and position tolerances; freedom for designing the cavities, even with nonuniform depths; plano and parallel surfaces with minimal roughness; and integration of defined open areas of optical windows for use with MOEMS and of...See full productRelated content from Photonics MediaPRODUCTSPromoted Content March 2024 IssuePrecision Polished SubstratesOhara is a world-class manufacturer of high-quality double-side lapped and polished substrates suitable for use at 248 nm. 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