Request InfoFINETECHFinetech Inc. has released the Opto-Bonder Femto, its latest device for the assembly of optoelectronic components and modules. The bonder can handle various assembly technologies, including power laser and laser bar binding, flip chip and VCSEL bonding, MEMS and MOEMS, and sensors. It features high accuracy of ±0.5 μm in a small footprint of 1270 × 900 mm. New features include a 25% larger table, motorized X-Y-Z and theta movements, and a substrate with a diameter up to 6 in. with automatic pattern recognition. Bonding processes are automatically controlled and require no operator...See full productRelated content from Photonics MediaPRODUCTSPhotonics Spectra June 2023 Issue3D Inspection SensorsThe ECCO 85+ range of 3D sensors from SmartRay GmbH provides 3D image quality for reliable inspection and measurement. 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