Request InfoApplied MaterialsApplied Materials Inc. has unveiled its Applied UVision 3, a deep-UV bright-field wafer inspection system with the critical defect detection sensitivity required for 45-nm front-end-of-line and immersion lithography applications. The system triples the number of laser beams scanning the wafer to provide fast throughput. Two new imaging modes extend sensitivity to 20 nm, and a flexible automatic defect classification engine enables quick access to defects of interest. 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