Request InfoSCHOTT North America Inc.Designed for optoelectronics applications, the AF 32 glass introduced by Schott North America Inc. is suitable for use in the wafer-level chip scale packaging and optics markets. Its coefficient of thermal expansion matches that of silicon, helping to prevent warp during the manufacture of complex assemblies and during reflow, when a wafer-level chip scale packaging imager is attached to a printed circuit board. Thicknesses range from 0.1 to 1.1 mm, and the fire-polished surface of the glass achieves a roughness value below 1 nm rms, eliminating the need for fine mechanical polishing. AF 32...See full productRelated content from Photonics MediaWEBINARSPhotonics.com 3/7/2019In Vivo Medical Laser Procedures: An OverviewThis webinar, presented by OFS, will provide an overview of current in vivo medical procedures performed using lasers and optical fibers. The presentation will begin with a brief history of...Photonics.com 7/22/2021STANDARDS UPDATE: Vision Standards: An Overview of Global and A3 DevelopmentsStandards play a key role in the vision and imaging industry by ensuring interoperability of components, increasing market size, and shortening the time it takes to get new products to market. As the...Photonics.com 3/27/2024Precision Planning: Simplified Laser Scanning with Predictive SoftwareConventional controllers for laser scan systems do not allow to predict the actual path of the laser beam on the work piece. A tedious process of testing different parameters and delay settings...Photonics.com 1/18/2018Fiberguide RARe Motheye Fiber: Random Anti-Reflective (RARe) Nanostructures on Optical Fibers as Replacement for AR CoatingsAnti-reflective (AR) coatings are now entering their second century and have remained virtually unchanged throughout their life. As power level and wavelength range requirements continue to increase,...