Request InfoMaster Bond Inc.HACKENSACK, N.J., August 1, 2008 – Master Bond Inc., has introduced a new high performance, low viscosity epoxy adhesive called EP41SMED for fast, room temperature curing, bonding applications. This compound has a 5 to 1 mix ratio by weight and has a handling time of as little as 10-15 minutes at ambient temperatures. Bonds are resistant to water, oil, and many organic solvents, as well as cold sterilants, ETO and gamma radiation. This product fully meets USP Class VI requirements and conforms to Title 21, US Code of Federal Regulations, FDA Chapter 1, Section 175.105 & 175.300 for food applications. Master Bond...See full productRelated content from Photonics MediaPRODUCTSPhotonics.com 4/10/2023Light-Curing AdhesiveThe Master Bond LED415DC90 is a one component adhesive system that cures rapidly upon exposure to a 405-nm wavelength LED light source without any oxygen inhibition. 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