Request InfoValley Design Corp., HeadquartersValley Design Corp. is offering precision dicing services for both R&D and high-volume requirements. The company's saws can handle materials such as silicon wafers, sapphire and quartz discs, silicon carbide, ferrites and ceramics, as well as compound semiconductors like GaN and InP with diameters up to 6 in. Dicing kerf can be as small as 1 mil and die size as small as 5 mils square.See full productRelated content from Photonics MediaPRODUCTSBioPhotonics Mar/Apr 2024 IssueMicroplate WellsThe series of wells that have been added to ibidi’s µ-Plates include an expansion to its µ-Plate 96 Well to include both square and round shapes. The plates are available in 24, 96,...Photonics.com 4/26/2023UV Cure AdhesiveThe Flashbond® UV-8601R UV cure adhesive from epoxySet Inc. is a medium viscosity acrylated urethane designed for high-stress applications. 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After...Cleanroom WipesMicroscopy Imbedding MediaCoating MaterialsCOMPANIESPhotonics Buyers' GuideValley Design Corp., HeadquartersSince 1975 Valley Design Corp. has been an industry leader in advanced materials processing, as providers of precision lapping, polishing, dicing, 4- and 5-axis CNC machining, grinding, core drilling...Photonics Buyers' GuideOhara CorporationOHARA manufactures more than 130 environmentally safe optical glass types, free of both lead and arsenic. More than 300 tons of optical glass are melted per month, available in the following forms of...Photonics Buyers' GuideGlass Fab Inc.A History of Quality Since 1974 Glass Fab Inc. has met customers' stringent specifications by providing fabricated parts made of optical glass, filter glass, fused quartz and fused silica, low...Photonics Buyers' GuideGAMDAN Optics Inc.Gamdan Optics consistently delivers super-low absorption optical crystals (LBO, BBO, KTP, and custom doped YVO4) with UV-grade super-polished surfaces and high damage threshold coatings to achieve...