Request InfoRudolph Technologies Inc.FLANDERS, N.J., Aug. 7, 2013 — Rudolph Technologies Inc. has released three application-specific configurations of its NSX 320 automated macro-defect inspection system for wafer-level packaging, 2.5D interposers and 3DICs (3-D integrated circuits) using through-silicon via as interconnects. The system measures film thickness (polymers, photoresist, glass), thin remaining silicon thickness, surface topography, and copper pillar and solder bump height. 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More than 300 tons of optical glass are melted per month, available in the following forms of...Photonics Buyers' GuideShanghai Optics Inc.ISO 9001 & ISO 13485 certified and D&B DUNS # 113515303 Shanghai Optics is an unparalleled custom system solution provider offering advance precision custom optical design, engineering,...Photonics Buyers' GuideOZ Optics LimitedEstablished in 1985, OZ Optics is a leading worldwide supplier of fiber optic components, test equipment and sensors. OZ Optics manufactures its products in three locations, Ottawa (Canada),...