Request InfoRudolph Technologies Inc.FLANDERS, N.J., Sept. 5, 2013 — Rudolph Technologies Inc. has added a streamlined version of its automated macro defect inspection and metrology systems to its NSX line. The NSX 220 was designed for inspection of wafers up to 300 mm at traditional semiconductor, MEMS and LED manufacturing facilities. The system uses grayscale image analysis (with color image capture) and can detect advanced macro defects such as scratches, voids, foreign materials, and mechanical and probe damage, while performing 2-D measurements on bumps, probe marks and edge-trim processes. It operates over a 10- to 0.5-µm range of...See full productRelated content from Photonics MediaPRODUCTSPhotonics.com 4/16/2024LED Lighting ControllersThe HCS-150-ZEB from Advanced Illumination is an LED lighting controller developed specifically for Zebra Iris GTX smart cameras. 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