Request InfoFirst Sensor Inc.Pacific Silicon Sensor Inc. has developed a method to produce flip-chip photodiodes with both contacts on the same face, allowing the device to have a front face without bond wires or other contact areas. The process moves aluminum from the front face to the rear under a controlled temperature gradient by a conductive channel of P-type material. The technology is available for 4-in. N-type silicon wafers in the resistivity range up to 50 (omega)-cm.See full productRelated content from Photonics MediaPRODUCTSPhotonics.com 9/22/2022Line LightThe COBRA HyperSpec SWIR 2.0 LED line light from ProPhotonix Ltd. is a SWIR hyperspectral device with 11 wavelengths filling the band from 950 to 1750 nm and a peak-to-valley ratio of <1.5. ...Photonics.com 9/12/2022Automotive FPGAsCertusPro-NX™ field-programmable gate arrays (FPGAs) from Lattice Semiconductor Corp. are designed for automotive and extended temperature applications. 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