Request Info3D-Micromac AGCHEMNITZ, Germany, July 19, 2018 — The microPRO RTP laser annealing system from 3D-Micromac AG is designed to enable several key process steps in semiconductor, power device, and MEMS manufacturing. Combining a state-of-the-art laser optic module with 3D-Micromac's modular semiconductor wafer processing platform, the microPRO RTP provides selective annealing with high repeatability and throughput in a versatile system. The microPRO RTP features a line scan option for vertical selective annealing and a step-and-repeat spot option for horizontal selective annealing. The system offers three optional laser wavelengths. ...See full productRelated content from Photonics MediaPRODUCTSBioPhotonics Nov/Dec 2022 IssueRadiation-Resistant Optical FiberThe Optran® UV NSS Fiber from Armadillo SIA provides deep-UV solarization and radiation resistance. 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