Request InfoLogitech Ltd.Logitech Ltd. has unveiled a wire saw that slices samples up to 4 in. square. The AWS1, designed for use in photonics, semiconductor and geological applications, can slice gallium arsenide, silicon and lithium niobate, as well as ceramics, cements and many polycrystalline materials. Users can move the sample, viewing its position on a digital readout that has a resolution of 10 µm, and can adjust the angle of the cut with a cross-slide. The integrated abrasive system produces a lapped finish.See full productRelated content from Photonics MediaWEBINARSPhotonics.com 1/9/2023Innovations in Ultrashort-Pulse and RF-Excited CO2 Lasers Expand Materials Processing ApplicationsIndustrial laser materials processing is constantly evolving. Industries as varied as pharmaceutical, consumer electronics, automotive, aerospace, and textiles, among others, have benefited from new...Photonics.com 1/18/2018Fiberguide RARe Motheye Fiber: Random Anti-Reflective (RARe) Nanostructures on Optical Fibers as Replacement for AR CoatingsAnti-reflective (AR) coatings are now entering their second century and have remained virtually unchanged throughout their life. As power level and wavelength range requirements continue to increase,...Photonics.com 6/30/2021European Photonics Manufacturing Services Funded by ECThis event is supported by the European initiatives presented and is moderated by EPIC, the European Photonics Industry Consortium. The European Commission is helping companies access the...Photonics.com 3/27/2024Precision Planning: Simplified Laser Scanning with Predictive SoftwareConventional controllers for laser scan systems do not allow to predict the actual path of the laser beam on the work piece. A tedious process of testing different parameters and delay settings...